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Company: Kaihua Xinrui Machinery Equipment Co., Ltd.

Mobile: 13735884470 (General Shi)

Address: Plot 1, Industrial Function Zone, Huabu Town, Kaihua County, Quzhou City, Zhejiang Province

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What are the characteristics of precision metal parts processing?
Edit:Kaihua Xinrui Machinery Equipment Co., Ltd.   UpDate:2021-07-21

Precision metal parts processing has many advantages. Where are the specific advantages of precision metal parts processing? The most obvious is that it can achieve high precision that ordinary processing can’t reach. High precision also depends on precision processing equipment and accurate restraint systems. The precision mask is used as an intermediary to achieve very fine control of the amount of material removed or added to the external surface layer. What are the characteristics of precision parts processing? The following is a detailed introduction by Kaihua Xinrui Machinery Equipment Co., Ltd.:

1. Cutting and processing of precision hardware parts

Mainly include precision turning, mirror grinding and grinding. Micro turning is performed on a precision lathe with a finely ground single crystal diamond turning tool. The cutting thickness is only about 1 micron. It is usually used to process high-precision and smooth surface parts, such as spherical mirrors, aspheric mirrors and flat mirrors made of non-ferrous metal materials.

2. Precision hardware parts processing

When the machining accuracy of precision parts is nanometers or even atomic units (atomic lattice distance is 0.1-0.2 nanometers), the processing methods of ultra-precision parts cannot be adapted. It is necessary to use special precision parts processing methods, namely chemical energy, electrochemical energy, thermal energy or electric energy, to make these energy exceed the bonding energy between atoms, so as to eliminate the adhesion, bonding or lattice deformation of certain atoms on the surface of the workpiece, so as to achieve The purpose of ultra-precision machining. Such processes include mechanical chemical polishing, ion sputtering and ion implantation, electron beam exposure, laser beam processing, metal evaporation and molecular beam epitaxy.


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